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The G-35 is a unique tool with significant applications for medical device manufacturers, model makers, electronic component assemblers, R&D and engineering labs, and any person or organization looking for enhanced technology for joining materials; particularly metals, ceramics, composites, and glass.

The G-35 allows for the fluxless soldering of metals, and even exotic materials such as Niobium, ceramics, and glass by the application of heat and ultrasonic energy as delivered via the tip of the ultrasonic iron. Nitinol, normally considered unsolderable, can be joined with the G-35, as was demonstrated by the Edison Welding Institute. The soldering iron is available in a variety of tip sizes and configurations.

Sonic energy from the tool causes cavitation within the molten solder. The imploding bubbles create shock waves that remove the oxide layers from the parts to be joined. The molten solder then permeates the microscopic pores and cracks in the substrate and forms an alloy layer on the substrate surfaces. The technology can be used to solder a variety of materials, including aluminum, ceramic, copper, gold, magnesium, metal oxides, nickel, silicon, silver, stainless steel, tantalum and titanium. It can also solder dissimilar materials, such as glass to metal.

Ultrasonic soldering involves the use of ultrasonic energy to remove or clean the oxide coating from materials. This process allows the solder to "wet" the surfaces. Conventionally, fluxes are used to remove this surface coating. The flux is a contaminant that is sometimes corrosive as well. Therefore, fluxless soldering can be very desirable at times. The ultrasonic energy also allows the wetting of various materials that even fluxes cannot wet such as ceramics and glass.

Because of the ultrasonic action on the micropores of the surfaces, highly nonporous joints are created which have very long, corrosive-free lifetimes. The benefits of this technology are multifold:

Customers include: Coherent Lasers, Boston Scientific, Corning Glass, General Motors, Mitsubishi, General Electric, Fermi Labs, IBM, Argonne Labs, DuPont, MIT, 3M, Westinghouse, and many other large and small companies, laboratories, and model shops.

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